Odroid-Hc4 with OLED

• Type: Dev.Board
• Chipset: Na
• Application: The Internet of Things
• Trademark: ODROID
• Origin: China
• Model NO.: ODROID-HC4 with OLED

Product Description

 

DESCRIPTION

ODROID-HC4 is new Home-Cloud platform based on the same ARM CPU as the ODROID-C4. We adopted a 12nm fabricated energy efficient 1.8Ghz Cortex-A55 quad core processor with faster 4GB DDR4 RAM. A 16MiB SPI flash chip exists on the board for the useful Petitboot feature.
Technical information at WiKi : odroid-hc4/odroid-hc4


This page product doesn't include OLED

We adopted a 12nm fabricated energy efficient 1.8Ghz Cortex-A55 quad core processor with faster 4GB DDR4 RAM. A 16MiB SPI flash chip exists on the board for the useful Petitboot feature.

We decided to drop the use of USB3.0 to SATA bridge solutions (quirks, additional IO layer, etc) for the ODROID HC4. We are therefore using a more native and reliable PCIe to SATA direct bridge solutions. In doing so the HC4 board provides two SATA storage docks.

A 5.5mm DC power jack, UHS-1 compatible micro-SD slot, USB 2.0, HD-MI 2.0 and 1GbE port are available on the rear side of the transparent shell case.

A CPU (Amlogic S905X3)
B DDR4 memory (4GiB)
C 2x SATA ports
D 1x RJ45 Ethernet port (10/100/1000)
E 1x HD-MI 2.0
F 1x USB 2.0 host port
G 1x DC power jack (Outer diameter : 5.5mm, inner diameter 2.1mm)
H 2x System LED indicators
I 1x UART for system console
J 1x IR receiver
K 5x GPIO pins (for optional OLED display)
L 1x Micro SD slot
M 1x Cooling fan
N 1x Boot switch

The toaster form factor ODROID HC4

accepts 2 x 3.5" or 2 x 2.5"" mechanical or SSD disks. You can obviously also use one mechanical and one SSD. See two examples shown below. Thanks to Linux LVM or mdadm you can combine two disks in RAID 0, RAID 1 or optimize IO with a large disk using one mechanical drive and an SSD for disk caching (LVM, bcache, etc).

Two 12TB high performance HDDs on the HC4

Two Samsung SSDs on the HC4

Block diagram

 

SATA interface performance

We connected a SATA SSD to the HC4 platform and measured the storage IO throughput. We could observe 390~420MB/s transfer speed which is not saturated at the maximum level ~500MB/s which is quite good for many applications.

SMB/CIFS network file transfer performance over the Gbit Ethernet connection

As shown below Windows OS client shows a sustainable 100+ MB/s transfer speed when we download/upload large files.

Downloading

Uploading

Helios LAN Test Result

Samsung 860 EVO 250GB SSD

Seagate Barracuda 2TB HDD (ST2000DM006)

Thermal Characteristics

The SoC temperature was around 50~60°C with very heavy computing loads while the chamber temperature was set at 30°C. There is a 40mm cooling fan in the case and it manages the SBC temperature well and the CPU runs without any thermal throttling.

We could keep reading the HDD temperature via smartctl command and it was around 40°C with a continuous heavy rsync test between two HDDs.

Thermographics

When the ambient temperature was 33°C, the HDD surface temperature was up to 45°C.

Once we used the same system at a normal 25°C room temperature, the HDD surface was lower than 40°C.

 

Power Consumption

 

Note 1: ST2000DM006 spin-down power consumption is 0.75W per HDD. Therefore, the HC4 idle mode power consumption is about 4W.

Note 2: Power consumption in Active state is tested while copying huge files through SAMBA service.

Note 3: Wake-up sources for the Suspend mode: Wake-on-LAN, IR remote receiver and RTC Alarm.

Software Support

Petitboot can find the OS on the SD card, the HDD or the SSD. So even if you do not have an SD card but you have a plugged-in HDD or SSD that has an OS installed, Petitboot will boot the HC4 using the OS from the HDD or SSD. Debian/Ubuntu OS can run with the Hardkernel's preinstalled OS image or Debian/Ubuntu Netboot Installer which you can obtain from the ODROID forum.

Supported Linux kernel versions are:

4.9.230 or newer (Hardkernel stock OS version)
Mainline kernel 5.8 or newer (Unofficial version from ODROID forum)

NOTE! Those marks are caused during process of injection molding, not defect or damage.

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